EDA Standards Booth Promotes Interoperability, Breakthrough in Standardization Demonstrated
Smart Booth Theme Sports SDOs Landing at DAC in San Francisco
Design Automation Conference -- San Francisco California -- June 15, 1998 -- Today the Electronic Industries Alliance (EIA) announced their commitment to interoperability via several standards efforts, many under the Alliance umbrella. Four standards efforts from six organizations are represented at the EDA Standards Booth. The standards bodies represented include Compact Model Council (CMC), Electronic CAD-CAM Exchange (Ecce), The Electronic Design Interchange Format (EDIF), and Input Output Buffer Information Specification (IBIS). Also represented is the EDA Consortium, who promote standards adoption through its standards committee and Electronics Industry Alliance who sponsored the booth. Each standard, in its own right, has made significant progress towards industry wide interoperability.
There is no doubt that one of the most important issues facing the EDA industry today is the development and adoption of industry standards. To further this cause, the EIA has organized a special exhibit at DAC this year to highlight their commitment to this pressing need. As a booth theme for DAC, a scheduled SDO is planned. The exhibit will provide clues to the meaning of the acronym "SDO" and a T-shirt drawing with be held for the individuals who guess correctly. The back drop mural will have a futuristic view of San Francisco.
Perhaps the most significant attraction at the booth is a working demonstration of CAD to CAM exchange via Ecce and EDIF. Industry leaders for both the CAD industry (Cadence Design Systems, Mentor Graphics, and Zuken-Redac) and CAM industry (Fabmaster, GraphiCode, Orbotech, and Valor) announce their commitment to creating interfaces using EDIF 4 0 0 and the Ecce information model and a working demonstrations of the CAD to CAM exchange can be seen at Standards Booth #438. As part of this display, Ecce is leveraging ECAD's use of the EDIF 4 0 0 as an exchange mechanism between CAD workstations and manufacturer's information requirements (CAM). This provides a formal link between design and manufacturing.
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Also significant are the efforts of the CMC formed to address the industry wide need for better compact models to address future technologies. The latest on IBIS, a method of providing the Input/Output device characteristics through V/I data (without disclosing any circuit/process information) will be represented. The 35th Design Automation Conference, held June 15-17 at the Moscone Convention Center in San Francisco, will feature 185 exhibits of the most compressive collection of EDA tool vendors ever assembled.
About Ecce
Ecce is a Defense Advanced Research Projects Agency (DARPA) funded program. The Ecce program will develop and demonstrate an integrated solution to providing compatibility between Computer Aided Design (CAD) and Computer Aided Manufacturing (CAM). For more information about Ecce, contact Stephen Fortier, Intermetrics Inc., 1595 Spring Hill Road, Suite 600, Vienna, VA 22182, USA Telephone: +1 703 827 2606; Fax: +1 703 827 5560; E-mail:sf@wash.inmet.com.
About CMC
The Compact Model Council (CMC) was formed from the SEMATECH sponsored Compact Model Workshop attendees to address the industry wide need for better compact models to address future technologies. Workshops have been held since March of 1995. The Council resides under the Design Automation Division of the Electronic Industries Alliance (EIA). For more information on the Compact Model Council, contact: Britt Brooks (TI) brittb@ti.com, (972) 997-6037 or Bhaskar Gadepally (Motorola) ra4382@email.sps.mot.com, (602) 655-3367 or visit the Website: http://www.eia.org/eig/CMC.
About IBIS
IBIS(Input Output Buffer Information Specification) is a method of providing the Input/Output device characteristics through V/I data without disclosing any circuit/process information. It can be thought of as a behavioral modeling specification suitable for transmission line simulation of Digital Systems and applicable to most digital components. For more information, contact EIA, 2500 Wilson Blvd., Arlington, VA 22201, phone: (703) 907-7545 /fax: (703) 907-7501.
About EDIF
The Electronic Design Interchange Format (EDIF) is a format used to interchange design data between CAD systems. The EDIF format is designed to be written and read by computer programs that are constituent parts of EDA systems or tools. Its syntax has been designed for easy machine parsing and is similar to LISP. By their very nature, the EDIF standards are behind the scenes for most EDA users. The development of EDIF has involved input from EDA vendors, designers and large user companies .The format has been standardized by the Electronic Industries Alliance (the `EIA'). EDIF Version 3 0 0 is also an ANSI standard and is completing the process of becoming an IEC standard; IEC 61690-1. EDIF Version 4 0 0 is also already an EIA/ANSI standard and is currently being reviewed within the IEC as IEC 61690-2.
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About EDAC
The EDA Consortium's mission is to foster communication and cooperation between EDA companies, customers, and stakeholders, driving industry-wide solutions to industry-wide problems. For more information contact the Electronic Design Automation Consortium (EDAC), 111 West Saint John Street (Suite 200), San Jose, California 95113, Phone: (408) 287-EDAC - Fax: (408) 283-5283, Email: information@edac.org.
About EIA
For more than 73 years the Electronic Industries Alliance has been the national trade organization representing US. electronics manufacturers. EIA represents the entire spectrum of companies involved in the design and manufacture of electronic components, parts, systems and equipment for communications, industrial, government and consumer uses. For more information on Electronic Industries Alliance, contact: Patti Rusher, 2500 Wilson Boulevard, Arlington, VA 22201 USA Telephone: +1 703 907 7545, Fax: +1 703 907 7501, E-mail: pattir@eia.org.
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