Agenda:
7:30 am Continental Breakfast and Registration
8:05 Welcome by host IBM John Ellis-Monaghan
8:15 Review of the agenda Britt Brooks
8:30 Council formation process Bhaskar Gadepally,
- Membership verification Britt Brooks
- Membership fees
- Vision-mission-roadmap
- Subcommittee/team identification
- Other issues
10:45 Break
11:00 Standardization options and info Britt Brooks,
Dr. Bernd Lemaitre
12:00pm Lunch
1:00 API kit update David Newmark,
Richard Kimmel
2:00 Break
2:15 BSIM3v3 update Chenming Hu
3:45 Summary and next meeting planning Bhaskar Gadepally,
Britt Brooks
4:30 Adjourn
Over 40 people attended the sixth Compact Model Workshop meeting held in Burlington, Vermont. Our host, IBM, represented by John Ellis-Monaghan began the day by welcoming all attendees and introducing Britt Brooks (TI) and Bhaskar Gadepally (Motorola), the Compact Model Council co-chairs.
Bhaskar Gadepally presented a proposal for the Council structure. The Council logistics needed to be refined and formalized. The first issue to be presented was the cost for membership. Consensus was reached that $10,000/year was reasonable for membership to the council. A second type of membership, called a Guest member was also agreed to at a much lower rate of $500/year. Guest members would be invited by member companies and the small fee was to assure that the Guest member also had a stake in the results of the Council.
The next issue was team formation and requirements. Once again, consensus was reached as to the size and nature of the teams. However, an interesting issue began to be raised. Who would own the Compact Model Council work? Who would be responsible for the handling of the financial aspects of the Council? This issue would persist throughout the Council formation process.
A Functional model of the Council was shown. Teams would be put in place that would oversee tasks based upon their grouping and the Council would guide the teams work. The majority of the attendees showed concern with fixed teams. The teams should be task driven, not fixed in place. The new proposal was to form teams based upon task need, rather than assigning tasks to teams.
As discussion began on the Voting and Consensus section, the issue of ownership of the projects that the Council pursues arose again. Based upon the understanding of the attendees, a proposal to incorporate the Council (similar to VHDL and OVI) was presented by Kim Hailey (Meta Software). Kim stated that in order to own the BSIM3v3 code and to pay out money on other tasks, something more that a standards organization was needed. By incorporating as a non-profit organization, we could avoid several legal issues and bookeeping requirements. The majority of the attendees agreed that this may be the best solution.
Based upon the direction of the discussions, the discussion on Council formation was suspended until after the Standardizations Options were presented. Britt Brooks began by showing definitions of the kinds of Standards that exist. The issue of who owns the standard (in this case, the BSIM3v3 model code) is relevant to all types of standards. Kim Hailey pointed out that the standardization bodies would have to own the standard before approving it.
After discussing what kinds of standardization are done, a summary of the Standards organizations that may be interested in this kind of work was shown. The next step would be to document the standardization process that the Council would choose. Britt Brooks and Al Hefner (NIST) presented the work currently underway in the Micro-electronic MOSFET task group for Model Validation. The test procedures developed by the Compact Model Workshop in previous meetings had been submitted to the IEEE via NIST. The two have an agreement to promote recommended practices from the Model Validation Working Group. The PAR (Project Authorization Request form) for the IEEE has been submitted for review. Final review should be complete by September 19, 1996.
The Working Group on Model Validation has a homepage that all attendees should visit (see http://ray.eeel.nist.gov/). For further directions on how to use the interactive database, contact Al Hefner at hefner@ray.eeel.nist.gov.
After the presentations were completed, the discussions returned to the Council formation topic. The obligations of the Council and obligations of the members to the council were agreed upon with slight variation.
The structure of meetings for the Council were presented along with the frequency of meetings for the Council as well as for the Workshops that would continue as Technical Exchange Vehicles. The proposed number of meetings would be two Council meetings per year and two Workshops per year.
After breaking for lunch, the updates on the API kits and the BSIM3v3 model sustaining effort were presented. The API type 1 for BSIM3v3 can simply plug into the type 2 interface. Also some more modifications were made to the type 2. For more detailed information on both, please see the presentation material of David Newmark (Motorola) and Rich Kimmel (IBM).
Chenming Hu (UCB) introduced Yuhua Cheng as the presentation for BSIM3v3 maintenance began. Yuhua covered several improvements, code changes, and modifications that would correct several of the reported problems with BSIM3v3 robustness. He showed several cases where the previous problem had been eliminated. He also reviewed the BSIM3v3 technical support structure and discussed the future plans for BSIM3v3 improvement. For more details, please see the presentation material for BSIM3v3 Maintenance.
Before the close of the meeting, Bernd Lemaitre (Siemens) gave a quick overview of the CENELEC tasks on standardization. This work was for transistor fabrication, including test structures and models. He stated that the closest the they could get to standardizing a MOSFET model was a paper detailing the model characteristics (Features and Equations). He also stated that the work took several years to develop and only produced guides, evidently it made little impact on the existing procedures. He commented that a strong buy-in from the participants with a way to enforce the proper usage would be of great benefit. CENELEC is the "European Commitee for Electrotechnical Standardization" which is composed of the national electrotechnical committees of the countries of Europe. Several of the projects CENELEC evaluates are JESSI projects.
Due to the newness of the proposal to incorporate, action items were not assigned to a single individual, rather teams were formed to address three major topics of concern:
Each topic had a set of specific issues to address. These are listed below by topic.
The companies volunteering to resolve these issues were Meta-Software, Mentor, Motorola, TI, FSA, UC Berkeley, Siemens, and Hitachi. Kim Hailey of Meta-Software was chosen as the team leader for this investigation. The issues are:
The companies volunteering to help with BSIM3v3 technical issues were UC Berkeley, TI, Motorola, NSC, IBM, Rockwell, AMD, Mentor, Meta-Software, Mitel, BTA, Cadence, Siemens, and Hitachi. Keith Green of TI was chosen as team leader. The issues are:
The companies volunteering to help with API kit issues were IBM, Motorola, Cadence, Siemens, TI, and Meta-Software. Cal Bittner of IBM was chosen as the team leader. The issues are:
The meeting adjourned after covering the assignments. The next meeting host volunteer was Motorola in Phoenix. The proposed date would be the week before IEDM at their site. The meeting would be for members of the corporation (or Model Council, to be determined). The results of the investigations and progress of the teams will be monitored via email and the SEMATECH repeater. After the call for members has been sent, all members should contact Britt Brooks and Bhaskar Gadepally to confirm their membership. As contacts are made, the repeater will be used to send out updates and new information.
Here is the list of attendees and their email addresses.
Narain Arora arora@simplex.com (408) 432-8260 Simplex Solutions, Inc., San Jose, CA Pratheep Balasingam theep@metasw.com (408) 369-5487 Meta-Software, Campbell, CA Peter Bendix pbendix@lsil.com (408) 954-3347 LSI Logic, Milpitas, CA Calvin Bittner cbittner@vnet.ibm.com (802) 769-6528 IBM, Essex Jct. VT Britt Brooks brittb@dadd.ti.com (214) 917-4569 Texas Instruments, Dallas, TX Yuhua Cheng yuhua@eecs.berkeley.edu (510) 642-1010 UC Berkeley, Berkeley, CA Akis Doganis akis_doganis@mentorg.com (408) 451-5822 Mentor Graphics, San Jose, CA Badih El-Kareh bek@btvlabvm.vnet.ibm.com (512) 424-8017 IBM, Austin TX John Ellis-Monaghan jjem@vnet.ibm.com (802) 769-8627 IBM, Essex Jct. VT Bhaskar Gadepally ra4382@email.sps.mot.com (512) 933-5020 Motorola, Austin, TX Keith Green krg@msg.ti.com (214) 480-7645 Texas Instruments, Dallas, TX Kim Hailey kimh@metasw.com (408) 369-5416 Meta-Software, Campbell, CA Jeffrey Hantgan jch@lucent.com (610) 712-3329 Lucent Technologies, Bell Labs, Allentown, PA Michael Hargrove mhargrove@vnet.ibm.com (914) 892-2049 IBM, Hopewell Jct. NY Doug Heaberlin heaberlin@vnet.ibm.com (802) 769-6934 IBM, Essex Jct, Vt. Allen Ray Hefner Jr. hefner@sed.eeel.nist.gov (301) 975-2071 NIST, Gaithersburg, MD Michael Hong mhong@opti.com (408) 486-8634 Opti Inc. Milpitas, CA Chenming Hu hu@EECS.Berkeley.EDU (510) 642-3393 UC Berkeley, Berkeley, CA Min-Chie Jeng mjeng@cadence.com (408) 944-7265 Cadence Design Systems, San Jose, CA Richard Kimmel rdk@vnet.ibm.com (914) 892-3225 IBM, Hopewell Jct. NY D.B.M. Klaassen klaassen@natlab.research.philips.com +31 40 2744251 Phillips, Netherlands Dr. Bernd Lemaitre lemaitre@earl.hl.siemens.de Siemens AG, Munich, Germany Sally Liu Sally.Liu@nb.rockwell.com (714) 221-6121 Rockwell Semiconductor System, Newport Beach, CA Tim Ma tianan_ma@mitel.com (613) 592-2122 Mitel Semiconductor, Kanata, Ontario, Canada Dr. Ferenc Masszi masszi@subpac.enet.dec.com (508) 568-6453 Digital, Hudson, Ma. Hiroo Masuda masuda@ddc.hitachi.co.jp +81 428 32 1111 Hitachi, Tokyo Japan Ext. 5136 Mishel Matloubian mishel.matloubian@nb.rockwell.com (714) 221-6641 Rockwell Semiconductor Systems, Newport Beach, CA Robi Mendel robi@verlioz.nsc.com (408) 721-4866 National Semiconductor, Santa Clara CA Mitika Miura-Mattausch mmm@pauli.zfe.siemens.de (089)636-45882 Siemens, Germany David Newmark david@fripp.sps.mot.com (512) 933-6099 Motorola, Austin, TX James Parker jparker@ammon.nsc.com (408) 721-8656 National Semiconductor, Santa Clara, CA Scott Parker sparker@vnet.ibm.com (802) 769-7316 IBM Essex Jct, Vt. Mario M. Pelella mpelella@vnet.ibm.com (914) 892-2511 IBM Hopewell Jct, NY Rosana Perez rosana@sr.hp.com (707) 577-5296 Hewlett-Packard, Santa Rosa, CA Odin Prigge prigge@hl.siemens.de +49 89 41445577 Siemens AG, Munich, Germany Marie Ricketts mricketts@vnet.ibm.com (802) 769-3876 IBM, Essex Jct. VT Khosro Rouz khosro_rouz@tmai.com (408) 328-0940 Technology Modeling Associates, Sunnyvale CA Tom Vrotsos t-vrotsos@ti.com (214) 480-7339 Texas Instruments, Dallas, TX Joe Watts jwatts@btv.ibm.com (802) 769-1874 IBM Essex Jct, VT Andreas Wild tdoc03@email.sps.mot.com (602) 655-5180 Motorola, Mesa AZ Richard Williams rqw@vnet.ibm.com (802) 769-5997 IBM Essex Jct, VT Larry Yu lyu@grape.amd.com (408) 749-3279 AMD, Sunnyvale, CA Peter (J.S.) Yuan jsy@engr.ucf.edu (407) 823-5719 Univ. of Central Florida, Orlando, FL Chune-Sin Yeh yeh@berlioz.nsc.com (408) 721-2549 National Semiconductor Bob Xu byx@btat.com (408) 986-1012 BTA Technology, Santa Clara, CA Quan Xiong Quan.Xiong@amd.com (408) 749-3411 Advanced Micro Devices, Sunnyvale CA