| 7:30am | Continental breakfast and registration | |
| 8:00am | Overview of day's agenda | Bhaskar Gadepally, Motorola |
| 8:05am | Welcome | Bertrand Cambou, Motorola |
| 8:15am | EIA Presentation | Patti Rusher, EIA - Electronic Information Group |
| 8:45am | API team review | David Newmark, Motorola |
| 9:30am | Break | |
| 9:45am | BSIM3v3 Team review | Keith Green, Texas Instruments Bernd Lemaitre, Siemens Chune-Sin Yeh, BTA |
| 11:45am | Lunch | |
| 1:00pm | CMC future plans | Britt Brooks, Texas Instruments Bhaskar Gadepally, Motorola Dick Klaassen, Philips |
| 2:30pm | Break | |
| 2:45pm | Resume discussions | All |
| 3:45pm | Summary and next meeting planning | Britt Brooks, Texas Instruments Bhaskar Gadepally, Motorola |
| 4:00pm | Adjourn |
Meeting opened: 8:00am on April 10th, 1997
Over 30 people attended the Compact Model Council meeting. This was the first Compact Model Council meeting since joining the EIA under the Electronic Information Group (EIG) in the Design Automation Division (DAD). The meeting was held at Motorola University in Phoenix. The host was Andreas Wild from Motorola. Bhaskar Gadepally (Motorola) presented the agenda and Bertrand Cambou, Senior Vice President and Director of Sector Technology, welcomed the attendees.
Patti Rusher (EIA) welcomed the CMC to the EIA and presented the major functions of the EIA. She covered how the EIA was organized, what benefits they can provide, and what are the requirements for membership. Patti passed out EIA Annual Reports as well as membership forms for the CMC. The membership, as of April 10th, 1997 is:
| IBM | Intel | Lucent Technologies |
| Motorola | Siemens | Texas Instruments |
Other companies pursuing membership, but not completed yet were:
| Cadence | Hewlett Packard | Philips |
The question was raised if the CMC would be located in the US only, due to the EIA being a US-based association. The answer was that standards produced by the EIA are ANSI acredited, but that EIA also has very good relationships with the major international standards groups as well. The IEC and EIAJ were two examples.
The need for more membership participation was presented by David Newmark (Motorola). The participants need to be the simulator owners from the respective companies, not the compact model developers. David reviewed the motivations for the API kits and asked for help from all the members to get participation from their simulator owners.
Dan FitzPatrick (Apteq) presented another possible solution to the API kit problem. It is a little more generic than the previous solutions discussed, as it can handle HDL's as well as compact models. The kit can be used on any SPICE2 or SPICE3 based simulator.
The Action items from this section were:
Keith Green (TI) began the review by showing the improvements made to BSIM3's homepage. The site contains the differences between BSIM3v3.0 and BSIM3v3.1.
Chune-Sin Yeh (BTA) presented results from 1/f noise modeling. The plots showed good agreement between data and simulation. Chune-Sin also showed some of BTA's experience with the capacitance model.
Peter Klein (Siemens) showed some of the problems Siemens has seen with the BSIM3v3.1 model. The majority of the attendees agreed that similar results have been seen and that these suggestions would be useful to pass on to UC Berkeley. Impact on a circuit was not shown, but Peter noted that a ring oscillator showed a difference in performance because of the model problems. The problems as well as possible means for solution will be passed on to UC Berkeley.
Keith finished the session with a review of current work at Berkeley. Included in these were:
Britt Brooks (TI) presented several items concerning the Council structure and how the Council would be organized. The EIA has guides for such organization, however, they encourage each group to use the format that best suits their needs. The largest deviation shown was the terms of elected officers. The EIA recommends terms of one year for the officers.
Britt also presented the plans for standardization for BSIM3v3. There were several steps that should be completed by the end of 1997. Discussions of the budget and how much administration fees would take out of the total membership contribution showed that the budget for 1997 is not firm. The administration costs will be determined based upon how much we use the EIA resources. Further, since the actual membership has not been established, the full amount of membership contributions has only been estimated thus far.
Dick Klaassen (Philips) presented ideas for future work for the CMC. He showed more MEXTRAM information for bipolar modeling and updated the Council on the status of Philip's models that have been released to public domain.
Britt presented the future tasks that the Council might consider. The membership numbers will determine how many of the tasks will actually be addressed, as well as membership interest.
The summary session began by polling the attendees as to which simulators they had used for BSIM3v3 work. The list showed several simulators support BSIM3v3. The following simulators have been tested and verified to give the same results that SPICE3 yields using the BSIM3v3 model:
| HSPICE | SPICE3 | Motorola SPICE (internal) |
| TISPICE3 (internal) | ACCUSIM2 (replaced ELDO) | SPECTRE |
It was noted that good agreement between SPICE3 and the other simulators was the case in the majority of the instances. Peter Bendix (LSI Logic) stated that he had seen wide differences from SPICE3 and HSPICE, but had not passed this information on to Avant!. The differences came from parameter bounding differences which could be addressed by the API kit(s) soultions.
The action item list and next meeting information was determined. The next meeting will be a membership only meeting. Here is the action item list:
Meeting closed: 3:40pm on April 10th, 1997
| http://www.eia.org/eig/CMC |
| http://ray.eeel.nist.gov |
| http://www-device.EECS.Berkeley.EDU/~bsim3 |
Here is the list of attendees and their email addresses.
Jason Alikpala Jason_Alikpala@hp.com (818) 876-6377 Hewlett Packard Narain Arora arora@simplex.com (408) 432-8260 Simplex Solutions, Inc., San Jose, CA Pratheep Balasingam theep@avanticorp.com (408) 328-8633 AVANT! Corporation, Campbell, CA Peter Bendix pbendix@lsil.com (408) 954-3347 LSI Logic, Milpitas, CA Britt Brooks brittb@dadd.ti.com (214) 917-4569 Texas Instruments, Dallas, TX Marie Burnham burnham@act.sps.mot.com (602) 655-3155 Motorola, Phoenix, AZ Ed Cheng edcheng@apteq.com Apteq Design Systems Inc. Dan FitzPatrick dkf@apteq.com (408) 551-6840 Apteq Design Systems Inc. Bhaskar Gadepally ra4382@email.sps.mot.com (512) 933-5020 Motorola, Austin, TX Keith Green krg@msg.ti.com (214) 480-7645 Texas Instruments, Dallas, TX Jeffrey Hantgan jeff.hantgan@bell-labs.com (610) 712-3329 Lucent Technologies, Bell Labs, Allentown, PA Paul Humphries paul.humphries@analog.com (617) 937-2008 Analog Devices Min-Chie Jeng mjeng@cadence.com (408) 944-7265 Cadence Design Systems, San Jose, CA Kuntal Joardar joardar@act.sps.mot.com (602) 655-2285 Motorola, Phoenix, AZ D.B.M. Klaassen klaassen@natlab.research.philips.com +31 40 2744251 Phillips, Netherlands Peter Klein pklein@earl.hl.siemens.de 89-636-22952 Siemens AG, Munich, Germany Dr. Bernd Lemaitre lemaitre@earl.hl.siemens.de 89-636-23775 Siemens AG, Munich, Germany Bill Liu liub@brahms.amd.com (408) 749-2942 Advanced Micro Devices Weidong Liu liuwd@bsim.eecs.berkeley.edu (510) 643-2636 Univ. of California, Berkeley, CA Mishel Matloubian mishel.matloubian@nb.rockwell.com (714) 221-6641 Rockwell Semiconductor Systems, Newport Beach, CA Mac McKeen mmckeen@microchip.com Microchip Technology, Chandler, AZ David Newmark david@fripp.sps.mot.com (512) 933-6099 Motorola, Austin, TX Junichi Ohanti jun@saskg.semicon.sony.co.jp 81-462-30-5341 Sony Corporation, Japan Pekka Ojala pekkao@exar.com (510) 668-7543 EXAR Corporation Patti Rusher pattir@eia.org (703) 907-7545 EIA, Washington, DC Toshiyuli Saito saito@lsi.tmg.nec.co.jp 81-044-435-1518 NEC Corporation, Japan Marden Seavey seavey@subpac.enet.dec.com (508) 568-7216 Digital Equipment Corp, Hudson, MA C. Sudhama sudhama@act.sps.mot.com (602) 655-4022 Motorola, Phoenix, AZ Tom Vrotsos t-vrotsos@ti.com (214) 480-7339 Texas Instruments, Dallas, TX Joe Watts jwatts@btv.ibm.com (802) 769-1874 IBM Essex Jct, VT Ron Werner P24742@email.mot.com Motorola, Phoenix, AZ Andreas Wild tdoc03@email.sps.mot.com (602) 655-5180 Motorola, Phoenix, AZ Bob Xu byx@btat.com (408) 986-1012 BTA Technology, Santa Clara, CA Chune-Sin Yeh csy@btat.com (408) 987-4960 BTA Technology, Santa Clara, CA Larry Yu lyu@grape.amd.com Advanced Micro Devices
This meeting was conducted in accordance with the EIA Legal Guides and EIA Manual of Organization and Procedure.